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| Influence of minor Zn addition on the microstructural stability of Sn-0.7 wt% Cu solder after aging and electromigration | 212 |
| Maio 2025 | Junho 2025 | Julho 2025 | Agosto 2025 | Setembro 2025 | Outubro 2025 | Novembro 2025 | |
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| Influence of minor Zn addition on the microstructural stability of Sn-0.7 wt% Cu solder after aging and electromigration | 5 | 15 | 2 | 3 | 17 | 20 | 13 |
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| Bernardo Bortolotto Ilha_.pdf | 91 |
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| Brazil | 212 |
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